Core Applications and Industry Value of Ultra-Precision/Ultra-Fine Diamond Micropowder
Ultra-precision and ultra-fine diamond micropowder, as the hardest, sharpest, and most controllable particle size distribution superhard abrasive currently available, is becoming an irreplaceable key material in precision manufacturing. With the increasing demands for surface quality, processing precision, and material reliability from industries such as optics, electronics, semiconductors, and new energy, diamond micropowder is moving from traditional grinding and polishing to higher-end ultra-precision manufacturing, and its application scope is continuously expanding. Diamond micropowder particles are generally between 0.1–10 μm, with submicron and nano-sized ultrafine powders becoming core consumables in advanced manufacturing. They possess extremely high Mohs 10 hardness, high thermal conductivity, low coefficient of friction, and micro-cutting capabilities generated during processing, enabling atomic-level surface finishes on the processed materials. This is particularly evident in the final polishing stage of optical lenses, sapphire, ceramics, laser crystals, semiconductor wafers, and ultrahard metals, where they demonstrate irreplaceable advantages.
In the fields of optics and lasers, ultrafine diamond powder is primarily used for ultra-precision polishing of optical glass, infrared crystals, sapphire windows, high-reflectivity mirrors, and laser crystals. The optics industry demands extremely high surface roughness, typically requiring Ra < 1 nm. The sharp cutting edges of diamond powder, operating in a low-damage mode, effectively reduce stress layers and microcracks, improving light transmittance and optical performance. In the processing of sapphire mobile phone glass, infrared windows, telecommunication filters, and laser resonator lenses, diamond polishing slurries, diamond polishing pads, and diamond suspensions are critical consumables. Furthermore, ultrafine powder is also used in MRF (magnetorheological rheological polishing) and CMP (chemical mechanical polishing) processes. Through precise particle size control and surface coating technology, uniform cutting and low-defect polishing are achieved, significantly improving the processing efficiency and yield of optical components.
In the semiconductor and electronics industry, ultraprecision diamond powder is applied to the grinding and polishing of silicon wafers, silicon carbide (SiC), gallium nitride (GaN), sapphire substrates, and compound semiconductor wafers. With the explosive growth of SiC power devices and the third-generation semiconductor industry, the high hardness and brittleness of wafers place higher demands on grinding consumables. Diamond micropowder can rapidly remove material during the grinding stage and reduce surface roughness to the nanometer level during the polishing stage, minimizing surface damage and thus improving device yield and heat dissipation performance. In the display panel industry, diamond micropowder is widely used for ultra-precision polishing of glass covers, watch glass, 3D cover glass, and AR/VR optical components. Its high processing efficiency can shorten the molding cycle, improve product consistency, and significantly improve production line yield and cycle time.
In high-hardness fields such as cemented carbide, ceramics, and metal matrix composites, ultrafine diamond micropowder is widely used for precision grinding of tool edges, precision polishing of molds, surface strengthening of aerospace structural components, and precision forming. While cemented carbide tools can improve wear resistance and cutting life after edge passivation and polishing, diamond micropowder can achieve micro-cutting while maintaining sharpness, resulting in a uniform and rounded microstructure on the cutting edge. In the precision mold industry, such as injection molds, die-casting molds, and optical molds, diamond micron powder polishing can achieve sub-nanometer mirror-like effects, significantly improving mold life, demolding performance, and molding quality. In the automotive, aerospace, and energy equipment industries, diamond micron powder is also used for ultra-precision grinding of some special materials, such as hard ceramic turbine components, nickel-based superalloys, and carbon fiber composites, giving the parts higher reliability and performance stability.
As the application fields continue to expand, the preparation technology of ultra-precision diamond micron powder is also constantly being upgraded. Currently, the mainstream preparation methods include high-strength artificial diamond crushing, detonation (nanodiamond), chemical methods, and surface modification techniques. To meet the higher requirements for stability and suspension in the optics and semiconductor industries, high-quality micron powder is usually coated, such as with metals, inorganics, organics, and surfactants, thereby improving dispersibility, heat resistance, and processing consistency. Ultrafine-grained diamond is gradually replacing traditional polishing materials such as cerium oxide and alumina in CMP processes, further improving the flatness and processing efficiency of wafers and optical components. In the future, with the development of intelligent manufacturing, quantum communication, precision medical devices and advanced optoelectronic devices, ultra-precision diamond micro powder will continue to expand its application boundaries and become an indispensable key basic material in the materials processing industry.
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